Akasa AK-460 Thermal Compound heat sink compound 3.3 W/m·K 3.5 g

SKU: AKAAC25
MPN: AK-460
Weight: 0.08kg
£6.00 Ex VAT
Manufacturer Brand Image
ProGrade Silicone Technology Evolution leads to Outstanding Thermal Performance Prograde Silicone technology evolution thermal compound delivers a stable and reliable thermal performance. Minimised resistance and maximised efficiency truly enables you to get more from your cooler. RoHS compliant. Features Outstanding performance of heat transfer between CPU and heatsink. Low thermal resistance for heat transfer, 0.16cm²C/W @60 um BLT. Maximum thermal conductivity, 3.3W/mK. Electrically nonconductive. Low bleed under high pressure. Multilanguage instructions included.
Brand
  • Akasa


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Akasa (Europe) Ltd
UK Address:
Unit 31, Metropolitan Centre,
Tauton Road,
Greenford,
UB6 8UQ,
England

Website (UK): akasa.co.uk

Email (UK): sales@akasa.co.uk


EU Address:
De Donge 17,
5684 PX Best,
The Netherlands


Website (EU): akasa.co.uk

Email (EU): euinfo@akasa-europe.com

This product complies with the General Product Safety Regulation (GPSR) and meets all relevant EU safety standards.

For detailed compliance documents, please review the provided link above.

If you have any questions or require further assistance, you can:

  • Contact the manufacturer directly at the listed addresses or support emails.
  • Email Northamber Product Safety at productsafety@northamber.com.













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